John Lau：在 Z-Library 上搜索

您通往知識和文化的門戶。每個人都可以使用。

Don't use scam websites

已應用篩選

精確匹配

精確匹配

圖書 (33)
最受歡迎
- 排序方式×
- 最受歡迎
- 最佳匹配
- 最近添加的
- 按標題 (A-Z)
- 按標題 (Z-A)
- 按年
- 文件大小↓
- 文件大小↑
列表
- 列表
- 表格

1

Classical Chinese Literature: An Anthology of Translations - Volume I: From Antiquity to the Tang Dynasty

Classical Chinese Literature: An Anthology of Translations - Volume I: From Antiquity to the Tang Dynasty

Columbia University Press

John Minford, Joseph S.M. Lau

年:

2000

語言:

english

文件:

PDF, 32.23 MB

0 / 0

english, 2000

2

Diseño de accesorios

Diseño de accesorios

年:

2013

語言:

spanish

文件:

PDF, 19.74 MB

0 / 0

spanish, 2013

3

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

年:

2023

語言:

english

文件:

PDF, 30.19 MB

5.0 / 5.0

english, 2023

4

Heterogeneous Integrations

Heterogeneous Integrations

Springer Singapore

年:

2019

語言:

english

文件:

PDF, 27.74 MB

0 / 0

english, 2019

5

Flip Chip Technologies

Flip Chip Technologies

McGraw-Hill Professional

年:

1995

語言:

english

文件:

DJVU, 7.47 MB

0 / 0

english, 1995

6

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

McGraw-Hill Professional

John H. Lau, Ricky S.W. Lee, Ricky S. Lee

年:

1999

語言:

english

文件:

DJVU, 6.68 MB

0 / 0

english, 1999

7

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

McGraw-Hill Professional

年:

2000

語言:

english

文件:

DJVU, 8.39 MB

0 / 0

english, 2000

8

Microvias: For Low Cost, High Density Interconnects

Microvias: For Low Cost, High Density Interconnects

McGraw-Hill Professional

John H. Lau, S.W. Ricky Lee

年:

2001

語言:

english

文件:

PDF, 11.50 MB

0 / 0

english, 2001

9

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

年:

2024

語言:

english

文件:

PDF, 32.05 MB

0 / 5.0

english, 2024

10

Networking the Russian Diaspora: Russian Musicians and Musical Activities in Interwar Shanghai

Networking the Russian Diaspora: Russian Musicians and Musical Activities in Interwar Shanghai

University of Hawaii Press

Hon-Lun Helan Yang, Simo Mikkonen, John Winzenburg, Frederick Lau

年:

2020

語言:

english

文件:

PDF, 8.80 MB

0 / 5.0

english, 2020

11

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Springer Nature

年:

2023

語言:

english

文件:

EPUB, 316.34 MB

0 / 0

english, 2023

12

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

McGraw-Hill Professional

John H. Lau, Ricky S.W. Lee, Ricky S. Lee

年:

1999

語言:

english

文件:

DJVU, 7.73 MB

0 / 0

english, 1999

13

Bongo Grammar Book

Bongo Grammar Book

SIL South Sudan

Daniel Rabbi Moi Mario Lau Babur Kuduku Sister Mary Mangira Michael Simon Hagimir John Rapheal Zakenia Paul Mafoi Nyoul Gulluma Kuduku

年:

2014

語言:

english

文件:

PDF, 2.08 MB

0 / 0

english, 2014

14

Hydrology of the Hawaiian Islands

Hydrology of the Hawaiian Islands

University of Hawaii Press

L. Stephen Lau, John F. Mink

年:

2006

語言:

english

文件:

PDF, 8.51 MB

0 / 0

english, 2006

15

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Springer-Verlag Berlin Heidelberg

John Alan Robinson (auth.), John Lloyd, Veronica Dahl, Ulrich Furbach, Manfred Kerber, Kung-Kiu Lau, Catuscia Palamidessi, Luís Moniz Pereira, Yehoshua Sagiv, Peter J. Stuckey (eds.)

年:

2000

語言:

english

文件:

PDF, 13.12 MB

0 / 0

english, 2000

16

Hydrology of the Hawaiian Islands

Hydrology of the Hawaiian Islands

University of Hawaii Press

L. Stephen Lau, John F. Mink

年:

2006

語言:

english

文件:

PDF, 31.44 MB

0 / 0

english, 2006

17

За сто лiт

За сто лiт

McGraw-Hill Professional

年:

1930

語言:

ukrainian

文件:

DJVU, 7.31 MB

0 / 0

ukrainian, 1930

18

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Springer Nature

年:

2021

語言:

english

文件:

PDF, 44.12 MB

0 / 5.0

english, 2021

19

Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Springer Singapore

年:

2018

語言:

english

文件:

PDF, 25.20 MB

0 / 0

english, 2018

20

Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive

Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive

McGraw-Hill Professional

John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee

年:

2002

語言:

english

文件:

PDF, 24.19 MB

0 / 0

english, 2002

21

Advanced MEMS Packaging (Electronic Engineering)

Advanced MEMS Packaging (Electronic Engineering)

McGraw-Hill Education

John Lau, Cheng Lee, C. Premachandran, Yu Aibin

年:

2009

語言:

english

文件:

PDF, 13.97 MB

0 / 0

english, 2009

22

3D IC Integration and Packaging (Electronics)

3D IC Integration and Packaging (Electronics)

年:

2015

語言:

english

文件:

PDF, 169.90 MB

0 / 0

english, 2015

23

Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Springer Singapore;Springer

John H. Lau, Ning-Cheng Lee

年:

2020

語言:

english

文件:

PDF, 43.94 MB

5.0 / 5.0

english, 2020

24

Ultra-high frequency linear fiber optic systems

Ultra-high frequency linear fiber optic systems

Kam Y. Lau, John Park, Olav Solgaard

年:

2009

語言:

english

文件:

PDF, 6.38 MB

0 / 0

english, 2009

25

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Kwok-Ying Lau (editor), John J. Drummond (editor)

年:

2007

語言:

english

文件:

PDF, 2.37 MB

0 / 0

english, 2007

26

Solder Joint Reliability: Theory and Applications

Solder Joint Reliability: Theory and Applications

Colin MacKay (auth.), John H. Lau (eds.)

年:

1991

語言:

english

文件:

PDF, 19.02 MB

0 / 0

english, 1991

27

Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

John H. Lau (auth.), John H. Lau PhD, PE (eds.)

年:

1993

語言:

english

文件:

PDF, 26.43 MB

0 / 0

english, 1993

28

Advanced MEMS packaging

Advanced MEMS packaging

John H. Lau ... [et al.]

年:

2010

語言:

english

文件:

PDF, 13.98 MB

0 / 0

english, 2010

29

Ultra-high Frequency Linear Fiber Optic Systems

Ultra-high Frequency Linear Fiber Optic Systems

Kam Y. Lau, John Park, Olav Solgaard

年:

2009

語言:

english

文件:

PDF, 5.15 MB

0 / 0

english, 2009

30

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Springer Netherlands

Kah Kyung Cho (auth.), Kwok-Ying Lau, John J. Drummond (eds.)

年:

2007

語言:

english

文件:

PDF, 1.23 MB

0 / 0

english, 2007

31

Electronics Packaging Forum: Volume Two

Electronics Packaging Forum: Volume Two

Springer Netherlands

John H. Lau, Steve J. Erasmus, Donald W. Rice (auth.), James E. Morris (eds.)

年:

1990

語言:

english

文件:

PDF, 14.86 MB

0 / 0

english, 1990

32

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Husserl’s Logical Investigations in the New Century: Western and Chinese Perspectives

Springer Netherlands

Kah Kyung Cho (auth.), Kwok-Ying Lau, John J. Drummond (eds.)

年:

2007

語言:

english

文件:

PDF, 4.08 MB

0 / 0

english, 2007

33

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Computational Logic — CL 2000: First International Conference London, UK, July 24–28, 2000 Proceedings

Springer-Verlag Berlin Heidelberg

John Alan Robinson (auth.), John Lloyd, Veronica Dahl, Ulrich Furbach, Manfred Kerber, Kung-Kiu Lau, Catuscia Palamidessi, Luís Moniz Pereira, Yehoshua Sagiv, Peter J. Stuckey (eds.)

年:

2000

語言:

english

文件:

PDF, 17.77 MB

0 / 0

english, 2000